Titanium-Copper Clad Plate

Titanium-Copper Clad Plate
Details:
Material: Titanium, Copper
Standard: ASTM B898
Thickness: Base material 1-500mm, cladding material 1-100mm
Size: According to customer requirements
Brand: Qinhao
Process: Explosive bonding
Shape: Square
Surface Treatment: Annealing
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Description
Technical Parameters
product-526-394
I. Product Introduction

Titanium-copper-titanium composite plate is a metal composite material made of three layers of titanium/copper/titanium through explosive bonding, rolling bonding, or explosive rolling processes. Its structural feature is an outer layer of titanium and a middle layer of copper, presenting a "sandwich structure," with a titanium plate covering both sides of the copper plate. This three-layer structure combines the excellent corrosion resistance of titanium with the excellent electrical and thermal conductivity of copper, achieving a dual optimization of material performance and cost.

II. Process

Industrially, titanium-copper-titanium composite plate is mainly prepared using explosive bonding or hot rolling-explosive bonding methods. The core is to achieve atomic-level bonding of the metals through high-energy explosive impact or hot pressing, resulting in a strong interface bond and excellent performance.

First, the two metal plates to be bonded are placed with a certain gap between them, and then an appropriate amount of explosive is placed on top. The explosive is detonated at one end, with a velocity of several thousand meters per second. This explosive energy causes the titanium plate to collide with the base steel plate at an angle. At the point of impact, due to the extremely high deformation velocity and ultra-high pressure, both the steel and titanium plates exhibit fluid behavior. The oxide film and gas adsorbed layer on the two metal surfaces are removed as a metal jet, resulting in a clean, instantaneous bonding between the surfaces-a process known as cold bonding.

III. Applications

Electroplating and Electrolysis Industries;

PCB Etching and Circuit Manufacturing;

New Energy and Energy Storage Equipment;

Heat Exchangers and Condensers

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